Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler
| Attribute |
Value |
Test Method |
| Composition |
Ceramic filler + Silicone |
- |
| Color/Component A |
White |
Visual |
| Color/Component B |
Light Bule |
Visual |
| Density(g/cc) |
3 |
ASTM D792 |
| Usage Temperature(℃) |
-40~150 |
-- |
| Electrical |
|
|
| Breakdown Voltage(kv/mm) |
≥7.0 |
ASTM D149 |
| Dielectric Constant(@10mhz) |
7.3 |
ASTM D150 |
| Volume Resistivity(Ω.cm) |
1.0*1013 |
ASTM D257 |
| Flammability |
V-0 |
UL94 |
| Thermal |
|
|
| Thermal conductivity(W/m.K) |
3.0 |
ASTM D5470 |
| Viscosity/Component A (cps) |
400000 |
ASTM D2196 |
| Viscosity/Component B (cps) |
400000 |
ASTM D2196 |
| Hradness,after cure(shore OO) |
40 |
ASTM D22240 |
Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
Typical applications
■Applications that require one-part dispensing
■Any design where vertical gap stability and no pump out are required
■Devices demanding low assembly pressure
■Automotive electronics (ADAS, HEV, NEV, batteries, ECU)
■Telecommunications
■Computer and peripherals
■Between heat-generating semiconductors and a heat sink
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Two-part dispensable gap filler
TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.
Purchase information
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
Product Tags:
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Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose Images
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